IEEE International Conference on Flexible, Printable Sensors and Systems | FLEPS 2023
- 9-12 Jul 2023
- Boston, United States of America
- In-Person
- Engineering
Conference Description:
The IEEE International Conference on Flexible, Printable Sensors and Systems invites you to join the event in Boston, United States of America on coming 9-12 Jul 2023. The FLEPS 2023 is one of the premier events reporting research results on every aspect of Engineering fields. IEEE FLEPS 2023 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the area of Flexible and Printable Sensors and Systems.
Topics of Interest
- Organic/Inorganic Electronics and Sensors
- Emerging Materials for Flexible and Printable Systems
- Advanced Manufacturing Techniques
- High-throughput Printable Electronics
- Hybrid Flexible Sensors and Electronics
- Stretchable/Shrinkable Sensors and Electronics
- Soft/Smart Wearable and Implantable Sensing Systems
- Disposable/Reusable Sensors and Electronics
- Printed Large-Area Sensors and Systems
- Active and Passive Components (e.g. actuators, printed energy devices, smart labels, RFID etc.)
- Emerging applications of Flexible Electronics inc. IoT, smart cities etc.
- Reliability, Simulation and Modelling
- Flexible/Printable Electronics in context with Circular and Green Electronics
The conference will provide researchers with a forum for discussing the latest research results and promoting progress towards commercialization. Do not miss this opportunity to meet the leaders in their field, while enjoying the great places in Boston.
Schedule:
- Conference Date:
- 9-12 Jul 2023
- Abstract Submission Deadline:
- Feb 20 2023
- Registration Deadline:
- Jul 9 2023